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RP605Z363B-E2-F

零件编号 RP605Z363B-E2-F
产品分类 电源管理 - 专业
制造商 RICOH/Nisshinbo Micro Devices
描述 300MA ULTRA-LOW POWER BUCK BOOST
封装
包装 卷带式 (TR)
数量 4250
RoHS 状态 YES
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库存:
总数

数量

价格

总价

1

$2.5305

$2.5305

10

$2.2785

$22.7850

25

$2.1525

$53.8125

100

$1.8270

$182.7000

250

$1.7220

$430.5000

500

$1.5015

$750.7500

1000

$1.2495

$1,249.5000

2500

$1.1550

$2,887.5000

5000

$1.1130

$5,565.0000

获取报价信息
产品参数
产品说明
PDF(1)
类型描述
制造商RICOH/Nisshinbo Micro Devices
系列RP605x
包装卷带式 (TR)
产品状态ACTIVE
包装/箱20-XFBGA, WLCSP
安装类型Surface Mount
工作温度-40°C ~ 85°C (TA)
电压 - 电源1.8V ~ 5.5V
应用领域Battery Management, Power Supplies
供电300nA
供应商设备包20-WLCSP-P3 (2.32x1.71)

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Panasonic Electronic Components
RES 68 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 560 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 5.1K OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 43K OHM 5% 3W AXIAL
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